Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing

ABSTRACT

An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.10/954,792, filed Sep. 30, 2004, and published Mar. 30, 2006, as U.S.Publication No. US-2006-0065874 A1, entitled “Isolation Valve andCoolant Connect/Disconnect Assemblies and Methods of Fabrication forInterfacing a Liquid Cooled Electronics Subsystem and an ElectronicsHousing” by Campbell et al., which is hereby incorporated herein byreference in its entirety.

TECHNICAL FIELD

The present invention is directed to cooling assemblies and methods forremoving heat from electronic devices and modules. More particularly,this invention relates to an isolation valve assembly for use with aliquid cooled electronics subsystem and associated electronics housingwhich supplies coolant to the liquid cooled electronics subsystem. Stillmore particularly, this invention relates to an enhancedconnect/disconnect assembly for a thermal dissipation assemblyextracting heat from heat generating components of an electronicssubsystem disposed operationally within an electronics housing.

BACKGROUND OF THE INVENTION

As it is well known, as the circuit density of electronic chip devicesincreases in order to achieve faster and faster processing speeds, thereis a correspondingly increasing demand for the removal of heat generatedby these devices. The increased heat demand arises both because thecircuit devices are packed more closely together and because thecircuits themselves are operated at increasingly higher clockfrequencies. Nonetheless, it is also known that runaway thermalconditions and excessive heat generated by chips is a leading cause offailure of chip devices. Furthermore, it is anticipated that demand forheat removal from these devices will increase indefinitely. Accordingly,it is seen that there is a large and significant need to provide usefulcooling mechanisms for electronic circuit devices.

Each new generation of computers continues to offer increased speed andfunction. In most cases, this has been accomplished by a combination ofincreased power dissipation and increased packaging density. The netresult has been increased heat flux at all levels of packaging. Forexample, one packaging configuration for certain large computer systemstoday is a multi-blade server system, with each blade containing one ormore processor modules along with associated electronics, such asmemory, power and hard drive devices. These blades are removable unitsso that in the event of failure of an individual blade, the blade may beremoved and replaced in the field. One problem with this configurationis that the increase in heat flux at the blade level makes itincreasingly difficult to dissipate heat by simple air cooling.

Further, in certain data center equipment, a rack containing bladeserver systems may house several hundred or more microprocessors, whichsharply increases the heat dissipation requirements. These systems placean enormous burden on the facility air conditioning system, since allrack or blade server heat is conventionally dissipated into the roomambient air. These air cooled structures are becoming limited in theirthermal performance capability by the modest amount of air flowavailable for cooling. In addition to this restriction, with projectedper rack heat loads to exceed 25 kW in the near future, the burden onthe facility air conditioning is very high. Thus, an alternative to thestate of the art air cooling is desirable.

SUMMARY OF THE INVENTION

The needs of the prior art are addressed, and additional advantages areprovided, by the present invention, which in one aspect is a coolantisolation valve assembly usable with a liquid cooled electronicssubsystem which is insertable in an operational position within anelectronics housing. The coolant isolation valve assembly includes atleast one isolation valve and at least one actuation mechanism. The atleast one isolation valve is coupled to at least one of a coolant supplyline and a coolant return line providing liquid coolant to the liquidcooled electronics subsystem when operational within the electronicshousing. The at least one actuation mechanism is coupled to the at leastone isolation valve, and automatically translates a linear motion,resulting from insertion of the liquid cooled electronics subsystem inan operational position within the electronics housing, into arotational motion to open the at least one isolation valve and allowcoolant to pass therethrough. The at least one actuation mechanismoperates to automatically close the at least one isolation valve whenthe liquid cooled electronics subsystem is withdrawn from theoperational position within the electronics housing.

In another aspect, a coolant connect/disconnect assembly is provided fora liquid cooled electronics subsystem which is insertable in anoperational position within an electronics housing. This coolantconnect/disconnect assembly includes a compression valve coupling and anisolation valve assembly. The compression valve coupling includes afirst fitting and a second fitting. The first fitting is associated withthe liquid cooled electronics subsystem and the second fitting isassociated with the electronics housing. The first fitting and thesecond fitting automatically engage to allow coolant flow therethroughwhen the liquid cooled electronics subsystem is inserted in theoperational position within the electronics housing, and automaticallydisengage to prevent coolant flow when the liquid cooled electronicssubsystem is withdrawn from the operational position within theelectronics housing. The isolation valve assembly is disposed within theelectronics housing serially and in fluid communication with the secondfitting of the compression valve coupling. The isolation valve assemblyincludes an isolation valve disposed in at least one of a coolant supplyline and a coolant return line within the electronics housing, and anactuation mechanism. The actuation mechanism automatically translates alinear motion, resulting from insertion of the liquid cooled electronicssubassembly in the operational position within the electronics housing,into motion to open the isolation valve and allow coolant flowtherethrough. The actuation mechanism operates to automatically closethe isolation valve when the liquid cooled electronics subsystem iswithdrawn from the operational position within the housing.

In a further aspect, a liquid cooled electronics system assembly isprovided which includes a plurality of electronics subsystems and anelectronics housing. The plurality of electronics subsystems areinsertable into the electronics housing in an operational position. Theassembly further includes a liquid coolant subsystem for providingliquid coolant to at least one electronics subsystem of the plurality ofelectronics subsystems. The liquid coolant subsystem includes at leastone isolation valve assembly having an isolation valve and an actuationmechanism. The isolation valve is coupled to at least one of a coolantsupply line and a coolant return line providing liquid coolant to the atleast one electronics subsystem when operational within the electronicshousing. The actuation mechanism is coupled to the isolation valve andautomatically translates a linear motion, resulting from insertion ofthe at least one electronics subsystem in the operational positionwithin the electronics housing, into a rotational motion to open theisolation valve and allow coolant flow therethrough. The actuationmechanism operates to automatically close the isolation valve when theat least one electronics subsystem is withdrawn from the operationalposition within the electronics housing.

Methods for fabricating the isolation valve and coolantconnect/disconnect assemblies disclosed herein are also described andclaimed.

Further, additional features and advantages are realized through thetechniques of the present invention. Other embodiments and aspects ofthe invention are described in detail herein and are considered a partof the claimed invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter which is regarded as the invention is particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The foregoing and other objects, features, andadvantages of the invention are apparent from the following detaileddescription taken in conjunction with the accompanying drawings inwhich:

FIG. 1A depicts one embodiment of a computer blade server system withinwhich a liquid coolant subsystem can be employed, in accordance with anaspect of the present invention;

FIG. 1B depicts a side elevational view of one embodiment of a blade forthe blade server system of FIG. 1A;

FIG. 1C depicts an end elevational view of one embodiment of a bladeserver housing for the blade server system of FIG. 1A, with the multipleblades of the blade server system removed therefrom;

FIG. 2 is a cross-sectional side elevational view of a simplifiedembodiment of a blade and blade server housing employing a compressionvalve coupling allowing blind connection of coolant flow paths toprovide coolant from the blade server housing to one or more cold plateswithin the blade, in accordance with an aspect of the present invention;

FIG. 3 depicts a cross-sectional side elevational view of one embodimentof a blade server housing showing a blade partially removed, whereinmultiple coolant connect/disconnect assemblies are shown each includingan isolation valve assembly in series with a compression valve coupling,in accordance with an aspect of the present invention;

FIG. 4 is a side elevational view of the blade and blade server housingembodiment of FIG. 3 showing the blade in operational position withinthe blade server housing, and showing the compression valve fittingsengaged and the isolation valve assemblies engaged to allow coolant flowtherethrough, in accordance with an aspect of the present invention;

FIG. 5 is an isometric view of one embodiment of an isolation valveassembly, in accordance with an aspect of the present invention;

FIG. 5A is an exploded view of the isolation valve assembly of FIG. 5,in accordance with an aspect of the present invention;

FIG. 6 is a partially assembled isometric view of the isolation valveassembly of FIGS. 5 & 5A showing the ball valve gate in a closedposition, in accordance with an aspect of the present invention;

FIG. 7 is a partially assembled isometric view of the isolation valveassembly of FIGS. 5 & 5A showing the ball valve gate in an openposition, in accordance with an aspect of the present invention;

FIG. 8 is an isometric view of another embodiment of an isolation valveassembly, in accordance with an aspect of the present invention;

FIG. 8A is an exploded view of the isolation valve assembly of FIG. 8,in accordance with an aspect of the present invention;

FIG. 9 is a partially cut-away isometric view of the isolation valveassembly of FIGS. 8 & 8A showing the butterfly valve in a closedposition, in accordance with an aspect of the present invention; and

FIG. 10 is a partially cut-away isometric view of the isolation valveassembly of FIGS. 8 & 8A showing the butterfly valve in an openposition, in accordance with an aspect of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

As used herein “liquid cooled electronics subsystem” refers to anyreceptacle, compartment, node, book, drawer, blade, etc., containing oneor more heat generating components of a computer system or otherelectronics system employing liquid cooling. The term “electronicsmodule” includes any heat generating component of a computer system orelectronics system, and may be, for example, one or more integratedcircuit devices, or one or more packaged electronics devices (such as aprocessor module). The term “electronics housing” includes any frame,rack, chassis, etc. designed to receive one or more liquid cooledelectronics subsystems; and may be, for example, a stand alone computerprocessor having high, mid or low end processing capabilities. In oneembodiment, an electronics housing may comprise one or more blade serversystem chassis, each having one or more blades requiring cooling.

By way of example, various aspects of the present invention aredisclosed hereinbelow with reference to a blade server system, oneembodiment of which is depicted in FIGS. 1A-1C. The blade server system100 of FIG. 1A includes an electronics housing or blade server chassis110 and multiple blades 120 (each comprising one example of anelectronics subsystem) which insert into the blade server chassis whenin operational position.

FIG. 1B depicts one simplified embodiment of a blade 120. Thiselectronics subsystem includes multiple processors upon which residerespective air cooled heat sinks 122. In this example, each blade is acomplete computer system, and includes, for example, DASD 124 and memorychips 126. Electrical connectors 128 are provided for electricallyconnecting blade 120 to the blade server chassis 110 (FIG. 1C). As shownin FIG. 1C, corresponding electrical connectors 130 are disposed withinthe blade server chassis for making electrical connection to connectors128 when the blade is inserted therein in an operational position.

As noted, advances in semiconductor technology have led to exponentialincreases in microprocessor performance. This has resulted in steepincreases in the amount of cooling required to ensure package operationand reliability. In data center equipment, such as racks containingmultiple blade server systems, hundreds or even thousands ofmicroprocessors may be placed in close proximity, resulting insignificant heat dissipation requirements.

FIG. 1B depicts the conventional use of air cooled heat sinks for theblades of the blade server system. These air cooled heat sinks mightinclude a vapor chamber base to spread heat from the chip package andtransfer it, via fins, to the ambient air. Unfortunately, these aircooled structures are limited in their thermal performance capability bythe relatively modest amount of air flow available for cooling. Inaddition, with projected rack heating loads to exceed 25 kW in the nearfuture, the burden on facility air conditioning continues to grow,particularly when a facility contains a large number of blade serversystems. Thus, as an alternative, liquid coolant based solutions arebelieved to be advantageous. Unfortunately, liquid based solutions areaccompanied by reliability concerns, and must be designed to beleak-proof. In addition, the customer would require the option ofinserting and removing a blade in the field while the system is inoperation. Thus, the cooling system also needs to be modular. Inaddition to the benefits noted, liquid cooling can further reduce devicetemperature, thus enhancing processor performance.

One technique for providing a modular, liquid cooled electronicssubsystem is described in commonly assigned, co-pending U.S. patentapplication Ser. No. 10/675,628, filed Sep. 30, 2003, entitled “ThermalDissipation Assembly and Fabrication Method for Electronics Drawer of aMultiple-Drawer Electronics Rack,” the entirety of which is herebyincorporated herein by reference. Presented herein below are severalalternative coolant subsystem embodiments for a liquid cooledelectronics subsystem, which are both modular and highly reliable. Theconcepts presented are applicable to any type of packaging structurewherein one level of packaging is inserted into a higher level ofpackaging and where heat dissipation requirements are significant.

FIG. 2 depicts one embodiment of a blade server system 200 having ablade chassis or housing 210 and one or more blades 220 insertedtherein. Each blade includes one or more processors 221 over which arespective cold plate 222 is disposed. Cooling liquid flows throughappropriate tubing 224 within the blade, and is provided from a facilitycoolant source passing through manifolds 240 and 250 associated with theelectronics housing 210. Self-sealing compression valve couplings 230include a first fitting 232 and a second fitting 234 between the blade220 and the housing 210 portions of the coolant supply lines. Thisallows blade 220 to be removed and returned to the electronics housingwithout any impact on the liquid cooling circuit. A supply manifold 240receives liquid coolant from a supply line(s) 241 and provides liquidcoolant to the coolant tubing 224 within the respective blade via aninlet coolant line 242. Similarly, an outlet manifold 250 receivessystem coolant from the coolant tubing of blade 220 via a respectivecoolant outlet line(s) 252 and discharges the heated coolant frommanifold 250 via a return line 251.

The first fitting and second fitting of the compression valve couplingare a blind connect/disconnect coupling which automatically establishesa fluid connection when blade 220 is inserted into an operationalposition within the electronics housing, and which automaticallydisengage when the blade is removed from the operational position. Byway of example, non-latching, automatic self-sealing couplings areavailable in the art from Parker Hannifin Corporation of Fort Worth,Tex. Other automatic self-sealing couplings appropriate for use inaccordance with the present invention are also commercially available.Preferably, the self-sealing coupling opens and seals automatically asthe liquid cooled electronics subsystem is inserted into and is removedfrom the operational position within the electronics housing. Because ofthe catastrophic nature of a failure of the second fitting, it isdesirable to provide a further guarantee that liquid coolant can notdischarge into the housing with withdrawal of an electronics subsystem.This might occur, for example, should a poppet within the second fittingof the compression valve stick, resulting in coolant being dischargedinto the blade server housing.

FIG. 3 depicts a further embodiment of the present invention wherein acoolant connect/disconnect assembly 300 is employed within the bladeserver housing 210 on both the coolant supply line and the coolantreturn line. Each connect/disconnect assembly 300 includes an isolationvalve assembly and, for example, the compression valve coupling 230 ofFIG. 2. The second fitting 234 of the compression valve coupling againcouples to the first fitting 232 associated with the respectiveremovable blade 220 as the blade is brought into or docked in anoperable position within the housing.

The isolation valve assembly 310 provides an additional level of coolantisolation protection for the system. In the event of failure of thequick connect coupling, the isolation valve assembly also ensures thatcoolant will not spray under pressure onto the electronics subsystems.Isolation valve assembly 310 includes an isolation valve disposed withina valve housing 312 and an actuation mechanism 314 coupled to theisolation valve. Actuation mechanism 314 includes a linearlytranslatable interface member 316, and converts linear movement ofmember 316 to, for example, rotational movement of the isolation valve.In the embodiment shown in FIG. 3, blade 220 is partially removed fromthe electronics housing 210 and thus the interface member 316 is shownextended, and the associated isolation valve is closed (see FIG. 6). Thesecond fitting of the compression valve coupling and the isolation valveof the isolation valve assembly are shown in fluid communication and aredisposed in series to ensure closing of, e.g., the coolant inlet lineand coolant outlet line upon withdrawal of the associated blade from theblade server chassis. The isolation valve assembly could, if desired,also be employed within the individual blades of the blade serversystem. However, the isolation valve assembly is particularly beneficialon the high pressure side of the compression valve couplings, that is,the blade server chassis side of the coupling. The first fitting 232 inthe respective blade is less likely to cause damage since there is lessforce on that coolant coupling when the blade is removed.

FIG. 4 depicts the assembly of FIG. 3 with blade 220 shown in anoperational position within blade server chassis 210, and first fitting232 and second fitting 234 engaged to allow coolant to passtherethrough. In addition, each interface member 316 is translated,resulting in actuation mechanism 314 rotating the respective isolationvalve in each isolation valve housing 312 to an open position.

One embodiment of an isolation valve assembly 310, in accordance with anaspect of the present invention, is depicted in FIGS. 5-7. In thisembodiment, the valve assembly 310 includes a ball valve housing 312 andan actuation mechanism 314 having a linearly reciprocating interfacemember 316. The ball valve housing 312 is disposed, for example, inseries within the inlet line 242 with second compression valve socket234. This isolation valve assembly provides enhanced shut off actuationupon withdrawal of a blade from the blade server housing. The isolationvalve assembly would be mechanically coupled to the blade serverhousing, while the blade need only have a rigid member aligned to theinterface member 316 to present a solid surface to contact the interfacemember when the blade is inserted into the operational position withinthe blade server housing. Isolation valve assembly 310 provides areliable shut off of coolant flow when the blade connection is broken,and a reliable turn on of coolant flow when the blade is reconnected inan operational position.

FIG. 5A depicts a more detailed embodiment of the isolation valveassembly of FIG. 5. The actuation mechanism 314 includes a rack 500 andpinion gear 510. One end of rack 500 comprises the interface member 316.Rack 500 reciprocates linearly via guide pins 524 and appropriatelyprovided guide pin grooves within the rack. One or more rack returnsprings 512 are employed to ensure automatic closing of the ball valvegate when the blade is removed from the operational position. The rackand pinion reside between a support block 520 and a cover plate 522. Thecover plate, support block, and ball valve housing are, in oneembodiment, fastened together rigidly, and the resultant assembly isrigidly fastened to, for example, the blade server chassis. The rack'smotion is restrained by the cover plate, guide block, and guide pins.

A shaft 530 connects pinion gear 510 to a ball valve gate 540 (in oneembodiment). Gate 540, which resides within a lower ball valve housing550 and an upper ball valve housing 560, rotates 90° between a closedposition and an open position, depending upon whether rack 500 isextended by springs 512 or translated by the associated blade (notshown). The ball valve gate is shown to be in series and in fluidcommunication with the second fitting or socket 234 of a correspondingcompression valve coupling as depicted in FIGS. 3 & 4. In operation, therack moves laterally when contacted by a respective electronicssubsystem, while the rack teeth engage the pinion gear, which rotatesthe ball valve gate with respect to the ball valve housing by means ofthe common shaft.

FIG. 6 depicts the isolation valve assembly of FIGS. 5 & 5A with therack return springs 512 relaxed, the rack 500 extended, and the ballvalve gate 540 in a closed position relative to the ball valve housing,i.e., the axis of the center hole in the ball valve gate is rotatedperpendicular to the axis of fluid passage in the ball valve housing,thus preventing fluid flow. Cover plate 522 and upper ball valve housing560 are shown in phantom and exploded view for clarity. The isolationvalve assembly depiction of FIG. 6 assumes that the associated blade hasbeen disengaged from the interface member end of rack 500, and is in anon-operational position. In the event of failure of fitting 234, theisolation valve assembly ensures that coolant can not spray underpressure onto the electronics of the blade or the electronics of theblade server chassis. The ball valve body should be coupled to the bladeserver coolant supply by means of a hose, tube, pipe, etc. As usedherein, “facility coolant” or “blade server coolant supply” refers todata center coolant provided through the blade server chassis, and whichby way of example, may refer to cooled (and possibly conditioned) wateror other coolant.

FIG. 7 again shows the assembled isolation valve assembly of FIGS. 5 &5A with cover plate 522 and upper ball valve housing 560 exploded andshown in phantom. In this example, rack return springs 512 arecompressed by rack 500, which is assumed to be engaging a blade inoperational position within the blade server housing. The compressedrack return springs 512 provide the force to return the rack to theextended position and close the valve when the blade is removed. Whenthe rack is compressed as shown, the ball valve gate 540 is in an openposition, with the axis of the center opening in the ball valve gatecoincident with the axis of the fluid passage in the ball valve body.

FIG. 8 depicts an alternate embodiment of an isolation valve assembly,generally denoted 800, in accordance with an aspect of the presentinvention. Assembly 800 can be used in place of assembly 310 of FIGS.5-7. In this example, the interface member 810 is assumed to bemechanically connected to or integrated with the blade (not shown).Assembly 800 includes an isolation valve disposed within a housing 830and an actuation mechanism 820 for translating linear reciprocal motionof interface member 810 to a rotational motion for opening and closingthe isolation valve within isolation valve housing 830. The isolationvalve is again shown in series and in fluid communication with a secondfitting portion 234 of a blind quick connect/disconnect coupling.

FIG. 8A depicts an exploded view of the isolation valve assembly of FIG.8. As shown, the actuation mechanism includes a structural housing 826within which is disposed a cam 822 and a cam/valve return spring 824. Acover 828 seals housing 826 except for an appropriately sized openingaligned to receive the reciprocating interface member 810 attached tothe associated blade. In this example, cam 822 is mechanically connectedvia a shaft 842 to a butterfly valve 840. Butterfly valve 840 resideswithin a lower valve housing 850 and an upper valve housing 860 and isin series and in fluid communication with the second fitting 234 of theblind connect/disconnect coupling.

In FIG. 9, the assembled isolation valve assembly 800 is partiallybroken away to show cam 822 in a neutral position with the cam spring824 relaxed and the butterfly valve 840 in closed position blocking anycoolant flow. In FIG. 10, the interface member 810 is shown engaging cam822 applying a force to spring 824 resulting in torsional stress on thespring and opening butterfly valve 840. The torsional stress of spring824 ensures return of cam 822 to the neutral position when the interfacemember 810 is removed withdrawal of the blade from an operationalposition within the blade server chassis.

Those skilled in the art will note from the above discussion thatprovided herein are an isolation valve assembly, a coolantconnect/disconnect assembly, a liquid cooled electronics systemassembly, and methods of fabrication thereof, which advantageously allowrepeated automatic shut-off and opening of isolation valves associatedwith a liquid coolant subsystem employed to cool one or more heatgenerating components of an electronics subsystem which is operable wheninserted into an electronics housing. The isolation valve assembly isreusable even after failure of an associated compression valve coupling.Automatic valve shut-off and automatic valve opening are provided via anactuation mechanism which translates a linear movement of theelectronics subassembly within the electronics housing to a rotationalmovement of the isolation valve. Reliable module level and rack levelliquid cooling of a plurality of electronics subsystems is facilitatedfor various electronics systems, such as a single computer or largercomputing and data processing equipment. Further, the concepts presentedcan be employed to design valve shut-off to occur momentarily prior tode-coupling, as well as valve opening to occur momentarily aftercoupling of the electronics subsystem in an operational position withinthe electronics housing. This ensures significantly lower pressure onthe compression valve coupling fittings at the time of de-coupling andat the time of coupling of the electronics subsystem to the liquidcoolant subsystem. The mechanical actuation member of the isolationvalve assembly can be separate from the compression valve coupling, andmay be positioned within the electronics housing or within theelectronics subsystem. A result of this is that the mechanical structureincorporating the compression valve coupling does not need to be locatedat the point of valve actuation.

Although preferred embodiments have been depicted and described indetail herein, it will be apparent to those skilled in the relevant artthat various modifications, additions, substitutions and the like can bemade without departing from the spirit of the invention and these aretherefore considered to be within the scope of the invention as definedin the following claims.

1. An isolation valve assembly usable with a liquid cooled electronicssubsystem insertable in an operational position within an electronicshousing, the isolation valve assembly comprising: at least one isolationvalve coupled to at least one of a coolant supply line and a coolantreturn line providing liquid coolant to the liquid cooled electronicssubsystem when operational within the electronics housing; and at leastone actuation mechanism coupled to the at least one isolation valve, theat least one actuation mechanism automatically translating a linearmotion, resulting from insertion of the liquid cooled electronicssubsystem in an operational position within the electronics housing,into a rotational motion to open the at least one isolation valve andallow coolant to pass therethrough, and wherein the at least oneactuation mechanism operates to automatically close the at least oneisolation valve when the liquid cooled electronics subsystem iswithdrawn from the operational position within the electronics housing.2. The isolation valve assembly of claim 1, wherein the at least oneisolation valve comprises at least one of a ball valve and a butterflyvalve, and is rotatable between an open position and a closed position,and wherein liquid coolant passes therethrough in the open position andis prevented from passing therethrough in the closed position.
 3. Theisolation valve assembly of claim 1, wherein the at least one actuationmechanism comprises an interface member disposed to move linearly as theliquid cooled electronics subsystem is inserted into the operationalposition within the electronics housing, the at least one actuationmechanism translating the linear movement of the interface member intothe rotational motion to open the at least one isolation valve.
 4. Theisolation valve assembly of claim 3, wherein the interface membercomprises a portion of a spring-biased rack and pinion subassembly ofthe at least one actuation mechanism, the spring-biased rack and pinionsubassembly translating the linear motion of the interface member intothe rotational motion of the at least one isolation valve.
 5. Theisolation valve assembly of claim 4, wherein the at least one isolationvalve is disposed in at least one of the coolant supply line and thecoolant return line within the electronics housing.
 6. The isolationvalve assembly of claim 5, further in combination with at least onecompression valve coupling, each compression valve coupling comprising afirst fitting and a second fitting, the first fitting being associatedwith the liquid cooled electronics subsystem and the second fittingbeing associated with the electronics housing, wherein the first fittingand the second fitting automatically engage to allow coolant to flowtherethrough when the liquid cooled electronics subsystem is inserted inthe operational position within the electronics housing, and wherein thefirst fitting and the second fitting automatically disengage and preventcoolant flow when the liquid cooled electronics subsystem is other thanin the operational position within the electronics housing, and whereinthe at least one isolation valve is in series with at least one secondfitting of the at least one compression valve coupling.
 7. The isolationvalve assembly of claim 6, wherein the liquid cooled electronicssubsystem comprises a blade of a blade server system and wherein theelectronics housing comprises a blade server chassis, the bladecomprising at least one heat generating component and at least one coldplate coupled to a surface thereof for removing heat therefrom, andwherein the blade further comprises tubing for conducting coolantbetween at least one first fitting of the at least one compression valvecoupling and the at least one cold plate.
 8. The isolation valveassembly of claim 3, wherein the interface member is attached to theliquid cooled electronics subsystem, and wherein the at least oneactuation mechanism further comprises a spring-biased cam, the interfacemember engaging the spring-biased cam with insertion of the liquidcooled electronics subsystem into the operational position within theelectronics housing, the spring-biased cam translating the linearmovement of the interface member to a rotational movement of the atleast one isolation valve.
 9. The isolation valve assembly of claim 8,wherein the at least one isolation valve is disposed in at least one ofthe coolant supply line and the coolant return line within theelectronics housing, and wherein the at least one isolation valvecomprises at least one of a ball valve and a butterfly valve, and isrotatable between an open position and a closed position, wherein liquidcoolant passes therethrough in the open position and is prevented frompassing therethrough in the closed position, and further in combinationwith: at least one compression valve coupling, each compression valvecoupling comprising a first fitting and a second fitting, the firstfitting being associated with the liquid cooled electronics subsystemand the second fitting being associated with the electronics housing,wherein the first fitting and the second fitting automatically engage toallow coolant flow therethrough when the liquid cooled electronicssubsystem is inserted in the operational position within the electronicshousing, and wherein the first fitting and the second fittingautomatically disengage and prevent coolant flow when the liquid cooledelectronics subsystem is other than in the operational position withinthe electronics housing, and wherein the at least one isolation valve isin series with at least one second fitting of the at least onecompression valve coupling.
 10. The isolation valve assembly of claim 9,wherein the liquid cooled electronics subsystem comprises a blade of ablade server system and wherein the electronics housing comprises ablade server chassis, the blade comprising at least one heat generatingcomponent and at least one cold plate coupled to a surface thereof forremoving heat therefrom, and wherein the at least one compression valvecoupling comprises two compression valve couplings, and wherein theblade further comprises tubing for conducting coolant between at leastone first fitting of the at least one compression valve coupling and theat least one cold plate.
 11. A coolant connect/disconnect assembly for aliquid cooled electronics subsystem insertable in an operationalposition within an electronics housing, the coolant connect/disconnectassembly comprising: a compression valve coupling comprising a firstfitting and a second fitting, the first fitting being associated withthe liquid cooled electronics subsystem and the second fitting beingassociated with the electronics housing, wherein the first fitting andthe second fitting automatically engage to allow coolant flowtherethrough when the liquid cooled electronics subsystem is inserted inthe operational position within the electronics housing, and wherein thefirst fitting and the second fitting automatically disengage and preventcoolant flow when the liquid cooled electronics subsystem is withdrawnfrom the operational position within the electronics housing; and anisolation valve assembly within the electronics housing disposedserially and in fluid communication with the second fitting of thecompression valve coupling, the isolation valve assembly comprising: anisolation valve disposed in at least one of a coolant supply line and acoolant return line within the electronics housing, and an actuationmechanism coupled to the isolation valve, the actuation mechanismautomatically translating a linear motion, resulting from insertion ofthe liquid cooled electronics subsystem in the operational positionwithin the electronics housing, into a rotational motion to open theisolation valve and allow coolant flow therethrough, wherein theactuation mechanism operates to automatically close the isolation valvewhen the liquid cooled electronics subsystem is withdrawn from theoperational position within the housing.
 12. The coolantconnect/disconnect assembly of claim 11, wherein the liquid cooledelectronics subsystem comprises a blade of a computer blade serversystem, and wherein the electronics housing comprises a blade serverchassis of the computer blade server system.
 13. The coolantconnect/disconnect assembly of claim 11, wherein the actuation mechanismcomprises an interface member disposed to move linearly as the liquidcooled electronics subsystem is inserted into the operational positionwithin the electronics housing, the actuation mechanism translating thelinear movement of the interface member into the motion to open theisolation valve.
 14. The coolant connect/disconnect assembly of claim13, wherein the interface member comprises a portion of a spring-biasedrack and pinion subassembly of the actuation mechanism, thespring-biased rack and pinion subassembly translating the linear motionof the interface member into the motion of the isolation valve.
 15. Thecoolant connect/disconnect assembly of claim 13, wherein the interfacemember is attached to the liquid cooled electronics subsystem, andwherein the actuation mechanism comprises a spring-biased cam, theinterface member engaging the spring-biased cam with insertion of theliquid cooled electronics subsystem into the operational position withinthe electronics housing, the spring-biased cam translating the linearmovement of the interface member to a rotational movement of theisolation valve.
 16. A liquid cooled electronics system assemblycomprising: a plurality of electronics subsystems; an electronicshousing, the plurality of electronics subsystems being insertable intothe electronics housing in an operational position; and a liquid coolantsubsystem for providing liquid coolant to at least one electronicssubsystem of the plurality of electronics subsystems, the liquid coolantsubsystem comprising at least one isolation valve assembly, the at leastone isolation valve assembly comprising: an isolation valve coupled toat least one of a coolant supply line and a coolant return lineproviding liquid coolant to the at least one electronics subsystem whenoperational within the electronics housing; and an actuation mechanismcoupled to the isolation valve, the actuation mechanism automaticallytranslating a linear motion, resulting from insertion of the at leastone electronics subsystem in the operational position within theelectronics housing, into a rotational motion to open the isolationvalve and allow coolant flow therethrough, wherein the actuationmechanism operates to automatically close the isolation valve when theat least one electronics subsystem is withdrawn from the operationalposition within the electronics housing.
 17. The liquid cooledelectronics system assembly of claim 16, wherein the plurality ofelectronics subsystems comprises a plurality of blades of a computerblade server system, and wherein the electronics housing comprises ablade server chassis of the computer blade server system.
 18. The liquidcooled electronics system assembly of claim 16, wherein the actuationmechanism comprises an interface member disposed to move linearly as theat least one liquid cooled electronics subsystem is inserted into theoperational position within the electronics housing, the actuationmechanism translating the linear movement of the interface member intothe rotational motion to open the isolation valve.
 19. The liquid cooledelectronics system assembly of claim 18, wherein the interface membercomprises a portion of a spring-biased rack and pinion subassembly ofthe actuation mechanism, the spring-biased rack and pinion subassemblytranslating the linear motion of the interface member into therotational motion of the isolation valve.
 20. The liquid cooledelectronics system assembly of claim 18, wherein the interface member isattached to the at least one electronics subsystem, and wherein theactuation mechanism comprises a spring-biased cam, the interface memberengaging the spring-biased cam with insertion of the at least oneelectronics subsystem into the operational position within theelectronics housing, the spring-biased cam translating the linearmovement of the interface member to the rotational motion of theisolation valve.
 21. The liquid cooled electronics system assembly ofclaim 16, wherein the liquid coolant subsystem further comprises acompression valve coupling comprising a first fitting and a secondfitting, the first fitting being associated with the at least oneelectronics subsystem and the second fitting being associated with theelectronics housing, wherein the first fitting and the second fittingautomatically engage to allow coolant flow therethrough when the atleast one electronics subsystem is inserted in the operational positionwithin the electronics housing, and wherein the first fitting and thesecond fitting automatically disengage and prevent coolant flow when theat least one electronics subsystem is withdrawn from the operationalposition within the electronics housing.